MIC2172BM
vs
MIC2172YN
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
|
Package Description |
SOIC-8
|
DIP,
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
9 Weeks
|
Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
40 V
|
40 V
|
Input Voltage-Min |
3 V
|
3 V
|
Input Voltage-Nom |
5 V
|
5 V
|
JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
JESD-609 Code |
e0
|
e3
|
Length |
4.93 mm
|
9.525 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Current-Max |
3.5 A
|
3.5 A
|
Output Voltage-Nom |
1.24 V
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
DIP
|
Package Equivalence Code |
SOP8,.25
|
DIP8,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
240
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.73 mm
|
|
Supply Current-Max (Isup) |
9 mA
|
|
Surface Mount |
YES
|
NO
|
Switcher Configuration |
BOOST
|
BOOST
|
Switching Frequency-Max |
115 kHz
|
115 kHz
|
Technology |
BIPOLAR
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.94 mm
|
7.62 mm
|
Base Number Matches |
2
|
1
|
Rohs Code |
|
Yes
|
Samacsys Manufacturer |
|
Microchip
|
|
|
|
Compare MIC2172BM with alternatives
Compare MIC2172YN with alternatives