MIC1555BM5TX
vs
MIC1555YMU
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
SOT-23, 5 PIN
|
UTDFN-10
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
IT CAN ALSO OPERATE AT 5V NOM
|
IT CAN ALSO OPERATE AT 15V NOM
|
| Analog IC - Other Type |
SQUARE; PULSE; RECTANGULAR
|
SQUARE; PULSE; RECTANGULAR
|
| JESD-30 Code |
R-PDSO-G5
|
S-XDSO-N10
|
| JESD-609 Code |
e0
|
|
| Length |
2.9 mm
|
2 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Frequency-Max |
5 MHz
|
5 MHz
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
LSSOP
|
HVSON
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
SOLCC10,.08,16
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Seated Height-Max |
1.45 mm
|
0.4 mm
|
| Supply Current-Max (Isup) |
0.4 mA
|
0.4 mA
|
| Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.95 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.6 mm
|
2 mm
|
| Base Number Matches |
1
|
3
|
|
|
|
Compare MIC1555BM5TX with alternatives
Compare MIC1555YMU with alternatives