MH89790BS vs PEF2035-P feature comparison

MH89790BS Microsemi Corporation

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PEF2035-P Infineon Technologies AG

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MITEL SEMICONDUCTOR INFINEON TECHNOLOGIES AG
Part Package Code SOIC DIP
Pin Count 40 40
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G40 R-PDIP-T40
JESD-609 Code e0
Number of Functions 1 1
Number of Terminals 40 40
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code GWDIP40,.9
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 45 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology HYBRID CMOS
Telecom IC Type FRAMER FRAMER
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Package Description DIP,
Length 50.9 mm
Seated Height-Max 5.1 mm
Width 15.24 mm

Compare MH89790BS with alternatives

Compare PEF2035-P with alternatives