MH89760B
vs
MH89770S
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ZARLINK SEMICONDUCTOR INC
|
MITEL SEMICONDUCTOR
|
| Package Description |
DIP, DIP40,1.3
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDIP-T40
|
R-PDSO-G40
|
| JESD-609 Code |
e0
|
|
| Length |
50.8 mm
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP40,1.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Current-Max |
0.025 mA
|
25 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
HYBRID
|
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
33 mm
|
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
40
|
|
|
|
Compare MH89760B with alternatives
Compare MH89770S with alternatives