MH88612BV-21 vs LE79555-4VC feature comparison

MH88612BV-21 Microsemi Corporation

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LE79555-4VC Microsemi Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ZARLINK SEMICONDUCTOR INC MICROSEMI CORP
Part Package Code SIP QFP
Package Description SIP, SIP20,.12 MS-026, TQFP-44
Pin Count 20 44
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Battery Feed CONSTANT CURRENT
Battery Supply -48 V
Hybrid 2-4 CONVERSION
JESD-30 Code R-XSIP-T20 S-PQFP-G44
JESD-609 Code e3 e3
Neg Supply Voltage-Nom -5 V
Noise-Max 14 dBrnC
Number of Functions 1 1
Number of Terminals 20 44
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PSRR-Min 26 dB
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code SIP TQFP
Package Equivalence Code SIP20,.12
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE FLATPACK, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 15.24 mm 1.2 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology HYBRID
Telecom IC Type SLIC SLIC
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish MATTE TIN MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.8 mm
Terminal Position SINGLE QUAD
Base Number Matches 1 2
Length 10 mm
Moisture Sensitivity Level 3
Width 10 mm

Compare MH88612BV-21 with alternatives

Compare LE79555-4VC with alternatives