MH88612BV-2 vs LE79555-3QC feature comparison

MH88612BV-2 Microsemi Corporation

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LE79555-3QC Microsemi Corporation

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MITEL SEMICONDUCTOR MICROSEMI CORP
Part Package Code SIP QFN
Package Description , SIP20,.12 8 X 8 MM, MO-220, QFN-32
Pin Count 20 32
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Battery Feed CONSTANT CURRENT
Battery Supply -48 V
Hybrid 2-4 CONVERSION
JESD-30 Code R-PSIP-T20 S-XQCC-N32
JESD-609 Code e0 e3
Neg Supply Voltage-Nom -5 V
Noise-Max 14 dBrnC
Number of Functions 1 1
Number of Terminals 20 32
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
PSRR-Min 26 dB
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Equivalence Code SIP20,.12
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology HYBRID
Telecom IC Type SLIC SLIC
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 0.8 mm
Terminal Position SINGLE QUAD
Base Number Matches 2 2
Length 8 mm
Moisture Sensitivity Level 3
Package Code HVQCCN
Seated Height-Max 1 mm
Width 8 mm

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