MGT5100TS/D vs SPC5200CBV466BR2 feature comparison

MGT5100TS/D NXP Semiconductors

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SPC5200CBV466BR2 Freescale Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 1.27 MM PITCH, PLASTIC, BGA-272 BGA, BGA272,20X20,50
Reach Compliance Code unknown not_compliant
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan NO YES
External Data Bus Width 32 32
Format FLOATING POINT FIXED POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B272 S-PBGA-B272
Low Power Mode YES YES
Number of Terminals 272 272
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Speed 66 MHz 466 MHz
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 2 1
Pbfree Code No
Rohs Code No
Part Package Code BGA
Pin Count 272
ECCN Code 3A991
Additional Feature ALSO REQUIRES 3.3V SUPPLY
Clock Frequency-Max 35 MHz
JESD-609 Code e0
Length 27 mm
Moisture Sensitivity Level 3
Package Equivalence Code BGA272,20X20,50
Peak Reflow Temperature (Cel) 245
Screening Level AEC-Q100
Seated Height-Max 2.65 mm
Supply Voltage-Max 1.58 V
Supply Voltage-Min 1.42 V
Supply Voltage-Nom 1.5 V
Terminal Finish TIN LEAD
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm

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