MGP55-5170-BTQ
vs
MGP55-5170-BTW
feature comparison
Pbfree Code |
No
|
Yes
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
RCD COMPONENTS INC
|
RCD COMPONENTS INC
|
Package Description |
MELF
|
MELF, ROHS COMPLIANT
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
Additional Feature |
PRECISION
|
PRECISION
|
JESD-609 Code |
e0
|
e3
|
Manufacturer Series |
MGP
|
MGP
|
Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
155 °C
|
155 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Shape |
CYLINDRICAL PACKAGE
|
CYLINDRICAL PACKAGE
|
Packing Method |
TR
|
TR
|
Rated Power Dissipation (P) |
0.25 W
|
0.25 W
|
Rated Temperature |
70 °C
|
70 °C
|
Resistance |
517 Ω
|
517 Ω
|
Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
Surface Mount |
YES
|
YES
|
Technology |
METAL FILM
|
METAL FILM
|
Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
Tolerance |
0.1%
|
0.1%
|
Working Voltage |
250 V
|
250 V
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MGP55-5170-BTQ with alternatives
Compare MGP55-5170-BTW with alternatives