MG80C186-10
vs
TS68000DESC03TA
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
THOMSON-CSF COMPSANTS SPECIFIC
|
| Part Package Code |
PGA
|
|
| Package Description |
CERAMIC, PGA-68
|
PGA, PGA68,10X10
|
| Pin Count |
68
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
20
|
|
| Bit Size |
16
|
32
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
20 MHz
|
|
| External Data Bus Width |
16
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-CPGA-P68
|
S-XPGA-P68
|
| JESD-609 Code |
e0
|
|
| Length |
29.46 mm
|
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
2
|
|
| Number of External Interrupts |
5
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
68
|
68
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
| Package Code |
PGA
|
PGA
|
| Package Equivalence Code |
PGA68,11X11
|
PGA68,10X10
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Screening Level |
38535Q/M;38534H;883B
|
38535Q/M;38534H;883B
|
| Seated Height-Max |
4.57 mm
|
|
| Speed |
10 MHz
|
10 MHz
|
| Supply Current-Max |
140 mA
|
335 mA
|
| Supply Voltage-Max |
5.25 V
|
|
| Supply Voltage-Min |
4.75 V
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
MOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
| Width |
29.46 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
3
|
|
|
|
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