MG50G1BL3 vs D64DV6 feature comparison

MG50G1BL3 Toshiba America Electronic Components

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D64DV6 Harris Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TOSHIBA CORP HARRIS SEMICONDUCTOR
Package Description FLANGE MOUNT, R-PUFM-X3 FLANGE MOUNT, O-MBFM-P2
Pin Count 3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Case Connection ISOLATED COLLECTOR
Collector Current-Max (IC) 50 A 50 A
Collector-Emitter Voltage-Max 450 V 450 V
Configuration DARLINGTON WITH BUILT-IN DIODE AND RESISTOR DARLINGTON WITH BUILT-IN DIODE AND RESISTOR
DC Current Gain-Min (hFE) 100 25
JESD-30 Code R-PUFM-X3 O-MBFM-P2
Number of Elements 1 1
Number of Terminals 3 2
Package Body Material PLASTIC/EPOXY METAL
Package Shape RECTANGULAR ROUND
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Form UNSPECIFIED PIN/PEG
Terminal Position UPPER BOTTOM
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 1 4
Rohs Code No
HTS Code 8541.29.00.95
JEDEC-95 Code TO-204AE
JESD-609 Code e0
Operating Temperature-Max 150 °C
Power Dissipation Ambient-Max 180 W
Power Dissipation-Max (Abs) 180 W
Terminal Finish TIN LEAD
Turn-off Time-Max (toff) 8000 ns
Turn-on Time-Max (ton) 1500 ns
VCEsat-Max 3 V

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