MFM8516JM-15
vs
HY29F040C-15I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOSAIC SEMICONDUCTOR INC
SK HYNIX INC
Part Package Code
QFJ
QFJ
Package Description
CERAMIC, JLCC-32
PLASTIC, LCC-32
Pin Count
32
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
150 ns
150 ns
JESD-30 Code
R-CQCC-J32
R-PQCC-J32
Memory Density
4194304 bit
4194304 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
512KX8
512KX8
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
J BEND
J BEND
Terminal Position
QUAD
QUAD
Type
NOR TYPE
NOR TYPE
Base Number Matches
2
1
Additional Feature
MINIMUM 100000 PROGRAM/ERASE CYCLES
Length
13.97 mm
Package Code
QCCJ
Seated Height-Max
3.556 mm
Terminal Pitch
1.27 mm
Width
11.43 mm
Compare MFM8516JM-15 with alternatives
Compare HY29F040C-15I with alternatives