MEC1424-SX-C0
vs
MEC1424-I/NU-C0
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
WFBGA-84
|
VTQFP-128
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Date Of Intro |
2017-10-20
|
2017-10-20
|
| JESD-30 Code |
X-PBGA-B84
|
S-PQFP-G128
|
| Number of Terminals |
84
|
128
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
TFQFP
|
| Package Shape |
UNSPECIFIED
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Screening Level |
TS 16949
|
TS 16949
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
2 V
|
2 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT
|
MICROPROCESSOR CIRCUIT
|
| Base Number Matches |
1
|
1
|
| Length |
|
14 mm
|
| Seated Height-Max |
|
1.2 mm
|
| Terminal Pitch |
|
0.4 mm
|
| Width |
|
14 mm
|
|
|
|
Compare MEC1424-SX-C0 with alternatives
Compare MEC1424-I/NU-C0 with alternatives