MDM11000JMB-12
vs
MSM511000BL-10JS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOSAIC SEMICONDUCTOR INC
LAPIS SEMICONDUCTOR CO LTD
Package Description
,
SON, SOLCC20/26,.35
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FAST PAGE
Access Time-Max
120 ns
100 ns
Additional Feature
RAS/CBR/HIDDEN REFRESH
JESD-30 Code
R-CDSO-J20
R-PDSO-N20
Memory Density
1048576 bit
1048576 bit
Memory IC Type
FAST PAGE DRAM
FAST PAGE DRAM
Memory Width
1
1
Number of Functions
1
Number of Ports
1
Number of Terminals
20
20
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
1MX1
1MX1
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
SOJ
SON
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
512
512
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
J BEND
NO LEAD
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Rohs Code
I/O Type
SEPARATE
JESD-609 Code
e0
Output Characteristics
3-STATE
Package Equivalence Code
SOLCC20/26,.35
Standby Current-Max
0.0002 A
Supply Current-Max
0.06 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
1.27 mm
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