MD82C52/B
vs
8501501XA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
HARRIS SEMICONDUCTOR
|
| Package Description |
DIP-28
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ICC_MAX AT FEXT = 2.4576MHZ
|
|
| Address Bus Width |
2
|
2
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
80C86; 80C88
|
80C86
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT
|
| Data Encoding/Decoding Method |
NRZ
|
NRZ
|
| Data Transfer Rate-Max |
0.125 MBps
|
0.125 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
R-GDIP-T28
|
R-GDIP-T28
|
| JESD-609 Code |
e0
|
|
| Low Power Mode |
YES
|
NO
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
|
|
| Number of Serial I/Os |
1
|
1
|
| Number of Terminals |
28
|
28
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP28,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
0
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Supply Current-Max |
3 mA
|
3 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
4
|
4
|
|
|
|