MD82C288-10/883
vs
KS82C88A-10IP
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
SAMSUNG SEMICONDUCTOR INC
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
R-XDIP-T20
|
R-PDIP-T20
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP20,.3
|
DIP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Supply Current-Max |
10 mA
|
5 mA
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
DIP
|
| Package Description |
|
DIP, DIP20,.3
|
| Pin Count |
|
20
|
| Bus Compatibility |
|
8088; 8086
|
| Clock Frequency-Max |
|
10 MHz
|
| Length |
|
26.6192 mm
|
| Seated Height-Max |
|
4.32 mm
|
| Supply Voltage-Max |
|
5.5 V
|
| Supply Voltage-Min |
|
4.5 V
|
| Width |
|
7.62 mm
|
| uPs/uCs/Peripheral ICs Type |
|
SYSTEM INTERFACE LOGIC, CONTROL AND COMMAND SIGNAL GENERATOR
|
|
|
|
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