MD80C31/B
vs
TSC80C31-12MG/883
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MATRA MHS
|
TEMIC SEMICONDUCTORS
|
| Package Description |
,
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
NO
|
NO
|
| Additional Feature |
BOOLEAN PROCESSOR
|
|
| Address Bus Width |
16
|
16
|
| Bit Size |
8
|
8
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
12 MHz
|
12 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
8
|
8
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
R-GDIP-T40
|
R-GDIP-T40
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
2
|
|
| Number of I/O Lines |
32
|
32
|
| Number of Serial I/Os |
1
|
|
| Number of Terminals |
40
|
40
|
| Number of Timers |
2
|
|
| On Chip Data RAM Width |
8
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| PWM Channels |
NO
|
NO
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
128
|
|
| ROM (words) |
0
|
0
|
| ROM Programmability |
ROM LESS
|
ROM LESS
|
| Speed |
12 MHz
|
12 MHz
|
| Supply Current-Max |
21 mA
|
15.8 mA
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
1
|
| Package Code |
|
DIP
|
| Screening Level |
|
MIL-STD-883
|
|
|
|
Compare MD80C31/B with alternatives
Compare TSC80C31-12MG/883 with alternatives