MD56V82161A-6TAP
vs
IS42S16160J-6BL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
LAPIS SEMICONDUCTOR CO LTD
INTEGRATED SILICON SOLUTION INC
Package Description
TSOP2,
TFBGA,
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.24
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
5.4 ns
5.4 ns
Additional Feature
AUTO/SELF REFRESH
PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH
JESD-30 Code
R-PDSO-G54
S-PBGA-B54
Length
22.22 mm
8 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
SYNCHRONOUS DRAM
SYNCHRONOUS DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
54
54
Number of Words
16777216 words
16777216 words
Number of Words Code
16000000
16000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
16MX16
16MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP2
TFBGA
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE
GRID ARRAY, THIN PROFILE, FINE PITCH
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
DUAL
BOTTOM
Width
10.16 mm
8 mm
Base Number Matches
1
1
Rohs Code
Factory Lead Time
10 Weeks
Samacsys Manufacturer
Integrated Silicon Solution Inc.
JESD-609 Code
e1
Peak Reflow Temperature (Cel)
260
Terminal Finish
TIN SILVER COPPER
Compare MD56V82161A-6TAP with alternatives
Compare IS42S16160J-6BL with alternatives