MD56V72160B-6TAZ03 vs AS4SD8M16DGCR-75/ET feature comparison

MD56V72160B-6TAZ03 LAPIS Semiconductor Co Ltd

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AS4SD8M16DGCR-75/ET Micross Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer LAPIS SEMICONDUCTOR CO LTD MICROSS COMPONENTS
Part Package Code TSOP2 TSOP2
Package Description TSOP2, TSOP2,
Pin Count 54 54
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.02 8542.32.00.02
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 5.4 ns 5.4 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PDSO-G54 R-PDSO-G54
Length 22.22 mm 22.22 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 54 54
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 105 °C
Operating Temperature-Min -45 °C
Organization 8MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TSOP2
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position DUAL DUAL
Width 10.16 mm 10.16 mm
Base Number Matches 2 1
JESD-609 Code e4
Terminal Finish NICKEL PALLADIUM GOLD

Compare MD56V72160B-6TAZ03 with alternatives

Compare AS4SD8M16DGCR-75/ET with alternatives