MCZ33903B3EK/R2
vs
MCZ33903C3EK
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
Package Description
HSSOP,
SOIC-32
Pin Count
32
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Adjustable Threshold
NO
YES
Analog IC - Other Type
SYSTEM BASIS CHIP
SYSTEM BASIS CHIP
JESD-30 Code
R-PDSO-G32
R-PDSO-G32
JESD-609 Code
e3
e3
Length
11 mm
11 mm
Moisture Sensitivity Level
3
3
Number of Channels
1
1
Number of Functions
1
1
Number of Terminals
32
32
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HSSOP
HSSOP
Package Equivalence Code
SOP32,.4,25
SOP32,.4,25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Seated Height-Max
2.45 mm
2.45 mm
Supply Voltage-Max (Vsup)
28 V
28 V
Supply Voltage-Min (Vsup)
5.5 V
5.5 V
Supply Voltage-Nom (Vsup)
10.5 V
10.5 V
Surface Mount
YES
YES
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Matte Tin (Sn)
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Width
7.5 mm
7.5 mm
Base Number Matches
1
2
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Technology
MOS
Compare MCZ33903B3EK/R2 with alternatives
Compare MCZ33903C3EK with alternatives