MCU0805C222JCT vs CL21C222JBNB feature comparison

MCU0805C222JCT SPC Multicomp

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CL21C222JBNB Samsung Electro-Mechanics

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MULTICOMP PRO SAMSUNG ELECTRO-MECHANICS
Package Description CHIP , 0805
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8532.24.00.20
Samacsys Manufacturer Multicomp Pro
Capacitance 0.0022 µF 0.0022 µF
Capacitor Type CERAMIC CAPACITOR CERAMIC CAPACITOR
Dielectric Material CERAMIC CERAMIC
Height 1.25 mm 1.25 mm
JESD-609 Code e3 e3
Length 2 mm 2 mm
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Multilayer Yes Yes
Negative Tolerance 5% 5%
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Style SMT SMT
Packing Method TR, PLASTIC, 7 INCH Bulk
Positive Tolerance 5% 5%
Rated (DC) Voltage (URdc) 50 V 50 V
Size Code 0805 0805
Surface Mount YES YES
Temperature Characteristics Code C0G C0G
Temperature Coefficient 30ppm/Cel ppm/°C 30ppm/Cel ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Width 1.25 mm 1.25 mm
Base Number Matches 1 1

Compare MCU0805C222JCT with alternatives

Compare CL21C222JBNB with alternatives