MCU0805-250.1%ATP55K05
vs
TNPW08055K05BECN
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
VISHAY DALE
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Additional Feature |
ANTI-SULFUR
|
|
| Construction |
Chip
|
|
| JESD-609 Code |
e3
|
e0
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.52 mm
|
|
| Package Length |
2 mm
|
|
| Package Style |
SMT
|
|
| Package Width |
1.25 mm
|
|
| Packing Method |
TR, Paper, 7 Inch
|
TR, PAPER, 7 INCH
|
| Rated Power Dissipation (P) |
0.125 W
|
0.1 W
|
| Reference Standard |
AEC-Q200
|
|
| Resistance |
5050 Ω
|
5050 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
0805
|
0805
|
| Surface Mount |
YES
|
YES
|
| Technology |
THIN FILM
|
THIN FILM
|
| Temperature Coefficient |
25 ppm/°C
|
25 ppm/°C
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
Tin/Lead (Sn/Pb)
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
0.1%
|
0.1%
|
| Working Voltage |
150 V
|
100 V
|
| Base Number Matches |
1
|
2
|
| Package Description |
|
CHIP, LEAD
|
| HTS Code |
|
8533.21.00.30
|
| Manufacturer Series |
|
TNPW
|
| Package Shape |
|
RECTANGULAR PACKAGE
|
| Rated Temperature |
|
70 °C
|
|
|
|
Compare MCU0805-250.1%ATP55K05 with alternatives
Compare TNPW08055K05BECN with alternatives