MCT83910
vs
MCT83103-3
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
GEC PLESSEY SEMICONDUCTORS
|
MICROSEMI CORP
|
| Package Description |
QIP, QUIP90B,1.1/1.3
|
QIP, QUIP90B,1.1/1.3
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ADDITIONAL POWER SUPPLY -15V+/-5%; BUILT-IN SELF TEST; DUAL PORT RAM
|
|
| Address Bus Width |
12
|
|
| Boundary Scan |
NO
|
|
| Clock Frequency-Max |
10 MHz
|
|
| Communication Protocol |
MIL STD 1553B
|
|
| Data Encoding/Decoding Method |
BIPH-LEVEL (MANCHESTER)
|
|
| Data Transfer Rate-Max |
0.125 MBps
|
|
| External Data Bus Width |
16
|
|
| JESD-30 Code |
R-CQIP-T90
|
R-XQIP-P90
|
| JESD-609 Code |
e0
|
|
| Low Power Mode |
NO
|
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
|
|
| Number of Serial I/Os |
2
|
|
| Number of Terminals |
90
|
90
|
| On Chip Data RAM Width |
16
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC
|
| Package Code |
QIP
|
QIP
|
| Package Equivalence Code |
QUIP90B,1.1/1.3
|
QUIP90B,1.1/1.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
2048
|
|
| Supply Current-Max |
540 mA
|
540 mA
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
PIN/PEG
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
|
|
| Base Number Matches |
4
|
4
|
|
|
|
Compare MCT83910 with alternatives