MCR8DSMT4G
vs
BT151X-800R,127
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TO-252
|
TO-220
|
| Package Description |
LEAD FREE, PLASTIC, CASE 369C-01, DPAK-3
|
|
| Pin Count |
3
|
3
|
| Manufacturer Package Code |
369C
|
SOT186A
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.30.00.80
|
8541.30.00.80
|
| Samacsys Manufacturer |
onsemi
|
|
| Case Connection |
ANODE
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Critical Rate of Rise of Off-State Voltage-Min |
2 V/us
|
50 V/us
|
| DC Gate Trigger Current-Max |
0.2 mA
|
15 mA
|
| DC Gate Trigger Voltage-Max |
1.5 V
|
1.5 V
|
| Holding Current-Max |
10 mA
|
20 mA
|
| JESD-30 Code |
R-PSSO-G2
|
R-PSFM-T3
|
| JESD-609 Code |
e3
|
e3
|
| Leakage Current-Max |
0.5 mA
|
0.5 mA
|
| Moisture Sensitivity Level |
1
|
|
| Non-Repetitive Pk On-state Cur |
90 A
|
132 A
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
3
|
| On-state Current-Max |
8000 A
|
7500 A
|
| Operating Temperature-Max |
110 °C
|
150 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RMS On-state Current-Max |
8 A
|
9 A
|
| Repetitive Peak Off-state Voltage |
600 V
|
800 V
|
| Repetitive Peak Reverse Voltage |
600 V
|
800 V
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
TIN
|
TIN
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Trigger Device Type |
SCR
|
SCR
|
| Base Number Matches |
3
|
2
|
| Circuit Commutated Turn-off Time-Nom |
|
70 µs
|
|
|
|
Compare MCR8DSMT4G with alternatives
Compare BT151X-800R,127 with alternatives