MCR18EZPF6202 vs MR12X6202FQL feature comparison

MCR18EZPF6202 ROHM Semiconductor

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MR12X6202FQL Walsin Technology Corporation

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROHM CO LTD WALSIN TECHNOLOGY CORP
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.6 mm
Package Length 3.2 mm 3.1 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.6 mm 1.6 mm
Packing Method TR, PAPER, 7 INCH TR, PAPER, 10 INCH
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C 70 °C
Reference Standard AEC-Q200; IATF 16949 AEC-Q200; MIL-STD-202
Resistance 62000 Ω 62000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish TIN OVER NICKEL TIN
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Additional Feature ANTI-SULFUR, RATED AC VOLTAGE (V): 200

Compare MCR18EZPF6202 with alternatives

Compare MR12X6202FQL with alternatives