MCR18EZHMJW821 vs D25200821JP5-E3 feature comparison

MCR18EZHMJW821 ROHM Semiconductor

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D25200821JP5-E3 Vishay Intertechnologies

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROHM CO LTD VISHAY INTERTECHNOLOGY INC
Package Description CHIP CHIP
Reach Compliance Code compliant unknown
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Packing Method TR, PAPER, 7 INCH TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C 70 °C
Resistance 820 Ω 820 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier MATTE TIN
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 5% 5%
Working Voltage 200 V 200 V
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8533.21.00.30
Additional Feature STANDARD: CECC40000/40400/40401-004,-006,-007,-802; IEC 60115-1
Manufacturer Series D

Compare MCR18EZHMJW821 with alternatives

Compare D25200821JP5-E3 with alternatives