MCR18EZHJ224 vs TSR8GJ224V feature comparison

MCR18EZHJ224 ROHM Semiconductor

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TSR8GJ224V Tateyama Kagaku Group

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ROHM CO LTD TATEYAMA KAGAKU GROUP
Package Description CHIP
Reach Compliance Code compliant unknown
Construction Rectangular Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.6 mm
Package Length 3.2 mm 3.2 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.6 mm 1.6 mm
Packing Method TR, PAPER, 7 INCH Tape
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C
Resistance 220000 Ω 220000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 5% 5%
Working Voltage 200 V 200 V
Base Number Matches 1 1
ECCN Code EAR99

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Compare TSR8GJ224V with alternatives