MCR18EZHF1211 vs RMCF1206FB1K21 feature comparison

MCR18EZHF1211 ROHM Semiconductor

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RMCF1206FB1K21 SEI Stackpole Electronics Inc

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROHM CO LTD STACKPOLE ELECTRONICS INC
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
Construction Rectangular Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.2 mm 3.2 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.6 mm 1.6 mm
Packing Method TR, PAPER, 7 INCH BULK
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C 70 °C
Resistance 1210 Ω 1210 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8533.21.00.30
Reference Standard AEC-Q200

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Compare RMCF1206FB1K21 with alternatives