MCR18EZHF1211
vs
RMCF1206FB1K21
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ROHM CO LTD
STACKPOLE ELECTRONICS INC
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
compliant
Construction
Rectangular
Chip
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.55 mm
Package Length
3.2 mm
3.2 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1.6 mm
1.6 mm
Packing Method
TR, PAPER, 7 INCH
BULK
Rated Power Dissipation (P)
0.25 W
0.25 W
Rated Temperature
70 °C
70 °C
Resistance
1210 Ω
1210 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
1206
1206
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin (Sn) - with Nickel (Ni) barrier
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
200 V
200 V
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8533.21.00.30
Reference Standard
AEC-Q200
Compare MCR18EZHF1211 with alternatives
Compare RMCF1206FB1K21 with alternatives