MCR18EZHF1130 vs RK73H2BRTTEB1130F feature comparison

MCR18EZHF1130 ROHM Semiconductor

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RK73H2BRTTEB1130F KOA Corporation

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROHM CO LTD KOA CORP
Package Description SMT, 1206 SMT, 1206
Reach Compliance Code compliant unknown
Construction Rectangular Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.6 mm
Package Length 3.2 mm 3.2 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.6 mm 1.6 mm
Packing Method TR, PAPER, 7 INCH TR, 13 Inch
Rated Power Dissipation (P) 0.25 W 0.25 W
Rated Temperature 70 °C
Resistance 113 Ω 113 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
ECCN Code EAR99
Additional Feature ANTI-SULFUR

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