MCR18ERTF1372
vs
RC3216F1372AS
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
CHIP
|
SMT, 1206
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8533.21.00.30
|
|
| Construction |
Chip
|
Chip
|
| JESD-609 Code |
e3
|
e3
|
| Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
155 °C
|
155 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.55 mm
|
0.55 mm
|
| Package Length |
3.05 mm
|
3.2 mm
|
| Package Shape |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Package Style |
SMT
|
SMT
|
| Package Width |
1.55 mm
|
1.6 mm
|
| Packing Method |
TR, PAPER, 7 INCH
|
TR, 13 INCH
|
| Rated Power Dissipation (P) |
0.25 W
|
0.25 W
|
| Rated Temperature |
70 °C
|
70 °C
|
| Reference Standard |
TS 16949
|
|
| Resistance |
13700 Ω
|
13700 Ω
|
| Resistor Type |
FIXED RESISTOR
|
FIXED RESISTOR
|
| Size Code |
1206
|
1206
|
| Surface Mount |
YES
|
YES
|
| Technology |
METAL GLAZE/THICK FILM
|
METAL GLAZE/THICK FILM
|
| Temperature Coefficient |
100 ppm/°C
|
100 ppm/°C
|
| Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
Tin (Sn) - with Nickel (Ni) barrier
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Tolerance |
1%
|
1%
|
| Working Voltage |
200 V
|
200 V
|
| Base Number Matches |
1
|
2
|
| Pbfree Code |
|
Yes
|
| Additional Feature |
|
PRECISION
|
| Series |
|
RC(PRECISION)
|
|
|
|
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