MCR10FZHF6651 vs 0805S8F6651B2E feature comparison

MCR10FZHF6651 ROHM Semiconductor

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0805S8F6651B2E Royal Electronic Factory (Thailand) Co Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROHM CO LTD ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Chip Chip
JESD-609 Code e3 e3
Manufacturer Series MCR10
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 2 mm 2 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.25 mm 1.25 mm
Packing Method TR, PAPER
Rated Power Dissipation (P) 0.125 W 0.125 W
Rated Temperature 70 °C
Resistance 6650 Ω 6650 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Series MCR10(F TOL) 0805(1/8WS,F TOL)
Size Code 0805 0805
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 150 V 150 V
Base Number Matches 1 1

Compare MCR10FZHF6651 with alternatives

Compare 0805S8F6651B2E with alternatives