MCR10EZHJ470 vs 0805S8J0470BD feature comparison

MCR10EZHJ470 ROHM Semiconductor

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0805S8J0470BD Royal Electronic Factory (Thailand) Co Ltd

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROHM CO LTD ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code compliant compliant
Samacsys Manufacturer ROHM Semiconductor
Construction Chip Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 2 mm 2 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.25 mm 1.25 mm
Packing Method TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.125 W 0.125 W
Rated Temperature 70 °C
Resistance 47 Ω 47 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0805 0805
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 5% 5%
Working Voltage 150 V 150 V
Base Number Matches 1 1
ECCN Code EAR99
Series 0805(1/8WS,GJ TOL)

Compare MCR10EZHJ470 with alternatives

Compare 0805S8J0470BD with alternatives