MCR10EZHF4701
vs
MC0805S8F4701T5E
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ROHM CO LTD
MULTICOMP PRO
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8533.21.00.30
Samacsys Manufacturer
ROHM Semiconductor
Multicomp Pro
Construction
Chip
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.55 mm
0.55 mm
Package Length
2 mm
2 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1.25 mm
1.25 mm
Packing Method
TR, PAPER, 7 INCH
TR
Rated Power Dissipation (P)
0.125 W
0.125 W
Rated Temperature
70 °C
70 °C
Resistance
4700 Ω
4700 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0805
0805
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin (Sn) - with Nickel (Ni) barrier
TIN OVER NICKEL
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
150 V
150 V
Base Number Matches
1
1
Compare MCR10EZHF4701 with alternatives
Compare MC0805S8F4701T5E with alternatives