MCR10EZHF2371 vs 0805S8F2371T2 feature comparison

MCR10EZHF2371 ROHM Semiconductor

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0805S8F2371T2 Royal Electronic Factory (Thailand) Co Ltd

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROHM CO LTD ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Chip Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 2 mm 2 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.25 mm 1.25 mm
Packing Method TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.125 W 0.125 W
Rated Temperature 70 °C
Resistance 2370 Ω 2370 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0805 0805
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 150 V 150 V
Base Number Matches 1 1

Compare MCR10EZHF2371 with alternatives

Compare 0805S8F2371T2 with alternatives