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MCR10ERTF1303 vs MC0805L6F1303SE feature comparison

MCR10ERTF1303 ROHM Semiconductor

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MC0805L6F1303SE SPC Multicomp

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ROHM CO LTD SPC TECHNOLOGY/ MULTICOMP
Package Description CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Chip Multilayer Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.5 mm 0.5 mm
Package Length 2 mm 2 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.25 mm 1.25 mm
Packing Method TR, PAPER, 7 INCH TR, Paper
Rated Power Dissipation (P) 0.125 W 0.125 W
Rated Temperature 70 °C
Reference Standard TS 16949
Resistance 130000 Ω 130000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0805 0805
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 150 V 150 V
Base Number Matches 1 1
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

Compare MCR10ERTF1303 with alternatives

Compare MC0805L6F1303SE with alternatives