MCR03EZP123 vs RM06JLN123 feature comparison

MCR03EZP123 ROHM Semiconductor

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RM06JLN123 TA-I Technology Co Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROHM CO LTD TA-I TECHNOLOGY CO LTD
Package Description CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.6 mm 1.6 mm
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method TR, Paper, 7 Inch TR, Paper, 7 Inch
Rated Power Dissipation (P) 0.1 W 0.1 W
Rated Temperature 70 °C
Reference Standard TS 16949
Resistance 12000 Ω 12000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish TIN OVER NICKEL Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 5% 5%
Working Voltage 50 V 50 V
Base Number Matches 1 1

Compare MCR03EZP123 with alternatives

Compare RM06JLN123 with alternatives