MCR03EZHJ331 vs RK73B1JLBC331J feature comparison

MCR03EZHJ331 ROHM Semiconductor

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RK73B1JLBC331J KOA Corporation

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ROHM CO LTD KOA CORP
Package Description CHIP SMT, 0603
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Samacsys Manufacturer ROHM Semiconductor
Construction Chip Chip
JESD-609 Code e3 e0
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.6 mm 1.6 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method TR, PAPER, 7 INCH Bulk
Rated Power Dissipation (P) 0.1 W 0.1 W
Rated Temperature 70 °C
Resistance 330 Ω 330 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 5% 5%
Working Voltage 50 V 50 V
Base Number Matches 1 2
Manufacturer Series RK73B1J(T,L5%TOL)
Series RK73B1J(T,L 5% TOL)

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