MCR03ERTD2151 vs TSR3UTD2151V feature comparison

MCR03ERTD2151 ROHM Semiconductor

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TSR3UTD2151V Tateyama Kagaku Group

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Rohs Code Yes
Part Life Cycle Code Not Recommended Active
Ihs Manufacturer ROHM CO LTD TATEYAMA KAGAKU GROUP
Package Description CHIP CHIP
Reach Compliance Code compliant unknown
Construction Chip Rectangular
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 1.6 mm 1.6 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 0.8 mm 0.8 mm
Packing Method TR, PAPER, 7 INCH TAPE
Rated Power Dissipation (P) 0.1 W 0.1 W
Rated Temperature 70 °C 70 °C
Reference Standard TS 16949 AEC-Q200
Resistance 2150 Ω 2150 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0603 0603
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 50 ppm/°C 50 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.5% 0.5%
Working Voltage 50 V 50 V
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8533.21.00.30
Additional Feature PRECISION

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