MCR006YRTJ430 vs MCR006YZPJ430 feature comparison

MCR006YRTJ430 ROHM Semiconductor

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MCR006YZPJ430 ROHM Semiconductor

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer ROHM CO LTD ROHM CO LTD
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Construction Chip Chip
JESD-609 Code e3 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.23 mm 0.23 mm
Package Length 0.6 mm 0.6 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 0.3 mm 0.3 mm
Packing Method TR, PAPER, 7 INCH TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.05 W 0.05 W
Rated Temperature 70 °C 70 °C
Reference Standard TS 16949 AEC-Q200
Resistance 43 Ω 43 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0201 0201
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 250 ppm/°C 250 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 5% 5%
Working Voltage 25 V 25 V
Base Number Matches 1 1
Additional Feature STANDARD: TS 16949

Compare MCR006YRTJ430 with alternatives

Compare MCR006YZPJ430 with alternatives