MCR006YLPF1004 vs RC01W105FBG feature comparison

MCR006YLPF1004 ROHM Semiconductor

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RC01W105FBG Fenghua (HK) Electronics Ltd

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer ROHM CO LTD FENGHUA ADVANCED TECHNOLOGY
Package Description CHIP CHIP
Reach Compliance Code compliant unknown
Samacsys Manufacturer ROHM Semiconductor
Construction Rectangular RECTANGULAR PACKAGE
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.23 mm 0.23 mm
Package Length 0.6 mm 0.6 mm
Package Shape RECTANGULAR PACKAGE RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 0.3 mm 0.3 mm
Packing Method TR, PAPER, 7 INCH Bulk
Rated Power Dissipation (P) 0.05 W 0.05 W
Rated Temperature 70 °C 70 °C
Reference Standard AEC-Q200; IATF 16949
Resistance 1000000 Ω 1000000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 0201 0201
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 25 V 25 V
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8533.21.00.30

Compare MCR006YLPF1004 with alternatives

Compare RC01W105FBG with alternatives