MCR006YLPF1004
vs
RC01W105FBG
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROHM CO LTD
FENGHUA ADVANCED TECHNOLOGY
Package Description
CHIP
CHIP
Reach Compliance Code
compliant
unknown
Samacsys Manufacturer
ROHM Semiconductor
Construction
Rectangular
RECTANGULAR PACKAGE
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.23 mm
0.23 mm
Package Length
0.6 mm
0.6 mm
Package Shape
RECTANGULAR PACKAGE
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
0.3 mm
0.3 mm
Packing Method
TR, PAPER, 7 INCH
Bulk
Rated Power Dissipation (P)
0.05 W
0.05 W
Rated Temperature
70 °C
70 °C
Reference Standard
AEC-Q200; IATF 16949
Resistance
1000000 Ω
1000000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
0201
0201
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
1%
1%
Working Voltage
25 V
25 V
Base Number Matches
1
1
ECCN Code
EAR99
HTS Code
8533.21.00.30
Compare MCR006YLPF1004 with alternatives
Compare RC01W105FBG with alternatives