MCP98242T-BE/MNYBAC vs TSE2002GB2A1NCG feature comparison

MCP98242T-BE/MNYBAC Microchip Technology Inc

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TSE2002GB2A1NCG Integrated Device Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC INTEGRATED DEVICE TECHNOLOGY INC
Package Description 2 X 3 MM, 0.75 HEIGHT, PLASTIC, TDFN-8 TDFN-8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.32.00.51
Accuracy-Max (Cel) 2 Cel 3 Cel
Body Breadth 2 mm
Body Height 0.75 mm
Body Length or Diameter 3 mm
Housing PLASTIC
JESD-609 Code e4 e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Bits 16 12
Number of Terminals 8
Operating Current-Max 0.5 mA 0.7 mA
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -20 °C
Output Interface Type 2-WIRE INTERFACE 2-WIRE INTERFACE
Output Voltage-Min 0.4 V
Package Body Material PLASTIC/EPOXY
Package Equivalence Code SOLCC8,.12,20
Package Shape/Style RECTANGULAR
Sensors/Transducers Type TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 2.3 V
Surface Mount YES YES
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Matte Tin (Sn)
Termination Type SOLDER SOLDER
Base Number Matches 1 2
Pbfree Code Yes
Part Package Code DFN
Pin Count 8
Manufacturer Package Code NCG8P1

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