MCP98242-BE/MCBAC
vs
TSE2002GB2A1NCG
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
INTEGRATED DEVICE TECHNOLOGY INC
|
Package Description |
3 X 2 MM, 0.90 MM HEIGHT, PLASTIC, DFN-8
|
TDFN-8
|
Reach Compliance Code |
unknown
|
compliant
|
Accuracy-Max (Cel) |
2 Cel
|
3 Cel
|
Body Breadth |
2 mm
|
|
Body Height |
0.9 mm
|
|
Body Length or Diameter |
3 mm
|
|
Housing |
PLASTIC
|
|
Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
Number of Bits |
16
|
12
|
Operating Current-Max |
0.5 mA
|
0.7 mA
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-20 °C
|
Output Interface Type |
2-WIRE INTERFACE
|
2-WIRE INTERFACE
|
Package Shape/Style |
RECTANGULAR
|
|
Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
2.3 V
|
Surface Mount |
YES
|
YES
|
Termination Type |
SOLDER
|
SOLDER
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
DFN
|
Pin Count |
|
8
|
Manufacturer Package Code |
|
NCG8P1
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.32.00.51
|
JESD-609 Code |
|
e3
|
Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare MCP98242-BE/MCBAC with alternatives
Compare TSE2002GB2A1NCG with alternatives