MCP9700T-H/TTVAO
vs
MCP9700-E/TO
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
SOT-23, 3 PIN
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microchip
|
Microchip
|
| Accuracy-Max (Cel) |
6 Cel
|
6 Cel
|
| Body Breadth |
1.3 mm
|
|
| Body Height |
1.005 mm
|
4.826 mm
|
| Body Length or Diameter |
2.9 mm
|
4.826 mm
|
| Housing |
PLASTIC
|
PLASTIC
|
| JESD-609 Code |
e3
|
e3
|
| Mounting Feature |
SURFACE MOUNT
|
THROUGH HOLE MOUNT
|
| Number of Bits |
12
|
12
|
| Number of Terminals |
3
|
3
|
| Operating Current-Max |
0.015 mA
|
0.015 mA
|
| Operating Temperature-Max |
150 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
TO-236
|
SIP3,.1,50
|
| Package Shape/Style |
RECTANGULAR
|
ROUND
|
| Screening Level |
AEC-Q100; TS 16949
|
TS 16949
|
| Sensors/Transducers Type |
TEMPERATURE SENSOR,ANALOG,RESISTANCE BASED
|
TEMPERATURE SENSOR,ANALOG,RESISTANCE BASED
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.3 V
|
2.3 V
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
7 Weeks, 1 Day
|
|
|
|
Compare MCP9700T-H/TTVAO with alternatives
Compare MCP9700-E/TO with alternatives