MCP73831T-2ACI/OT
vs
DS2756E+
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
SOT-23
|
SOIC
|
Package Description |
PLASTIC, SC-74A, SOT-23, 5 PIN
|
3 X 4.40 MM, LEAD FREE, TSSOP-8
|
Pin Count |
5
|
8
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microchip
|
|
Adjustable Threshold |
YES
|
YES
|
Analog IC - Other Type |
LINEAR BATTERY CHARGER
|
POWER SUPPLY SUPPORT CIRCUIT
|
JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Length |
2.9 mm
|
4.4 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
5
|
8
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
-20 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSSOP
|
TSSOP
|
Package Equivalence Code |
TSOP5/6,.11,37
|
TSSOP8,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.45 mm
|
1.1 mm
|
Supply Current-Max (Isup) |
1.5 mA
|
0.12 mA
|
Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3.75 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5.2 V
|
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.95 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Threshold Voltage-Nom |
+4.2V
|
|
Width |
1.6 mm
|
3 mm
|
Base Number Matches |
1
|
2
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MCP73831T-2ACI/OT with alternatives
Compare DS2756E+ with alternatives