MCP73123-22AI/MF
vs
LSP4054CLAD
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
LITE-ON SEMICONDUCTOR CORP
|
| Part Package Code |
DFN
|
SOT-23
|
| Package Description |
3 X 3 MM, 0.90 MM HEIGHT, PLASTIC, DFN-10
|
LSSOP,
|
| Pin Count |
10
|
5
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Adjustable Threshold |
YES
|
NO
|
| Analog IC - Other Type |
LINEAR BATTERY CHARGER
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
S-PDSO-N10
|
R-PDSO-G5
|
| JESD-609 Code |
e3
|
|
| Length |
3 mm
|
2.9 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
5
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
LSSOP
|
| Package Equivalence Code |
SOLCC10,.12,20
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
TS 16949
|
|
| Seated Height-Max |
1 mm
|
1.35 mm
|
| Supply Current-Max (Isup) |
1.5 mA
|
|
| Supply Voltage-Max (Vsup) |
6.5 V
|
6.5 V
|
| Supply Voltage-Min (Vsup) |
4.2 V
|
4.25 V
|
| Supply Voltage-Nom (Vsup) |
4.6 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Threshold Voltage-Nom |
+3.6V
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3 mm
|
1.6 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MCP73123-22AI/MF with alternatives
Compare LSP4054CLAD with alternatives