MCP6S26-I/SL
vs
ADS1196CZXGR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
SOIC
|
BGA
|
Package Description |
SOP, SOP14,.25
|
LFBGA,
|
Pin Count |
14
|
64
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
JESD-30 Code |
R-PDSO-G14
|
S-PBGA-B64
|
JESD-609 Code |
e3
|
e1
|
Length |
8.69 mm
|
8 mm
|
Moisture Sensitivity Level |
1
|
3
|
Number of Channels |
6
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
14
|
64
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
LFBGA
|
Package Equivalence Code |
SOP14,.25
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
TS 16949
|
|
Seated Height-Max |
1.75 mm
|
1.45 mm
|
Supply Current-Max (Isup) |
1.35 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.25 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
4 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
1.27 mm
|
0.8 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Width |
3.9 mm
|
8 mm
|
Base Number Matches |
1
|
1
|
ECCN Code |
|
EAR99
|
Additional Feature |
|
ALSO OPERATES WITH 1.65V TO 3.6V DIGITAL SUPPLY
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MCP6S26-I/SL with alternatives
Compare ADS1196CZXGR with alternatives