MCP662T-E/MS
vs
MCP665T-E/MF
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
TSSOP, TSSOP8,.19
|
HVSON, SOLCC10,.11,20
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Factory Lead Time |
5 Weeks
|
7 Weeks
|
Samacsys Manufacturer |
Microchip
|
|
Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
Average Bias Current-Max (IIB) |
0.005 µA
|
0.005 µA
|
Common-mode Reject Ratio-Min |
66 dB
|
66 dB
|
Common-mode Reject Ratio-Nom |
81 dB
|
81 dB
|
Frequency Compensation |
YES
|
YES
|
Input Offset Voltage-Max |
8000 µV
|
8000 µV
|
JESD-30 Code |
S-PDSO-G8
|
S-PDSO-N10
|
JESD-609 Code |
e3
|
e3
|
Length |
3 mm
|
3 mm
|
Low-Bias |
YES
|
YES
|
Low-Offset |
NO
|
NO
|
Micropower |
NO
|
NO
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
10
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
HVSON
|
Package Equivalence Code |
TSSOP8,.19
|
SOLCC10,.11,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
Packing Method |
TAPE AND REEL
|
TAPE AND REEL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Power |
NO
|
NO
|
Programmable Power |
NO
|
NO
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1 mm
|
Slew Rate-Nom |
32 V/us
|
32 V/us
|
Supply Current-Max |
18 mA
|
18 mA
|
Supply Voltage Limit-Max |
6.5 V
|
6.5 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Unity Gain BW-Nom |
60000
|
60000
|
Voltage Gain-Min |
25100
|
25100
|
Wideband |
NO
|
NO
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
DFN
|
Pin Count |
|
8
|
|
|
|
Compare MCP662T-E/MS with alternatives
Compare MCP665T-E/MF with alternatives