MCP6562-E/SN
vs
MCP6567T-E/MSVAO
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
SOIC
|
|
Package Description |
SOIC-8
|
TSSOP,
|
Pin Count |
8
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.39.00.01
|
Factory Lead Time |
5 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Amplifier Type |
COMPARATOR
|
COMPARATOR
|
Average Bias Current-Max (IIB) |
0.005 µA
|
0.005 µA
|
Input Offset Voltage-Max |
10000 µV
|
10000 µV
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e3
|
Length |
4.9 mm
|
3 mm
|
Moisture Sensitivity Level |
3
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Type |
PUSH-PULL
|
OPEN-DRAIN
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
TSSOP
|
Package Equivalence Code |
SOP8,.25
|
TSSOP8,.19
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TUBE
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
|
Response Time-Nom |
56 ns
|
80 ns
|
Seated Height-Max |
1.75 mm
|
1.1 mm
|
Supply Current-Max |
0.26 mA
|
0.26 mA
|
Supply Voltage Limit-Max |
6.5 V
|
6.5 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Matte Tin (Sn)
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
3.9 mm
|
3 mm
|
Base Number Matches |
1
|
1
|
Screening Level |
|
TS 16949
|
|
|
|
Compare MCP6562-E/SN with alternatives
Compare MCP6567T-E/MSVAO with alternatives