MCP6561U-E/OT
vs
LMC7211BIMX/NOPB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
NATIONAL SEMICONDUCTOR CORP
Package Description
LSSOP, TSOP6,.11,37
SOIC-8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.33.00.01
Amplifier Type
COMPARATOR
COMPARATOR
Average Bias Current-Max (IIB)
0.005 µA
0.001 µA
Bias Current-Max (IIB) @25C
0.005 µA
Input Offset Voltage-Max
10000 µV
18000 µV
JESD-30 Code
R-PDSO-G5
R-PDSO-G8
Length
2.9 mm
4.9 mm
Number of Functions
1
1
Number of Terminals
5
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Type
PUSH-PULL
PUSH-PULL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LSSOP
SOP
Package Equivalence Code
SOP6,.11,38
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
SMALL OUTLINE
Response Time-Nom
56 ns
4000 ns
Seated Height-Max
1.45 mm
1.75 mm
Supply Current-Max
0.13 mA
0.018 mA
Supply Voltage Limit-Max
6.5 V
16 V
Supply Voltage-Nom (Vsup)
1.8 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.95 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
1.6 mm
3.9 mm
Base Number Matches
1
2
Rohs Code
Part Package Code
SOIC
Pin Count
8
JESD-609 Code
e3
Moisture Sensitivity Level
1
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Terminal Finish
Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
40
Compare MCP6561U-E/OT with alternatives
Compare LMC7211BIMX/NOPB with alternatives