MCP6547-I/SN
vs
MCP6547-I/P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Part Package Code
SOIC
DIP
Package Description
3.90 MM, PLASTIC, SOIC-8
0.300 INCH, PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Factory Lead Time
5 Weeks
7 Weeks
Samacsys Manufacturer
Microchip
Microchip
Amplifier Type
COMPARATOR
COMPARATOR
Average Bias Current-Max (IIB)
0.0001 µA
0.0001 µA
Input Offset Voltage-Max
7000 µV
7000 µV
JESD-30 Code
R-PDSO-G8
R-PDIP-T8
JESD-609 Code
e3
e3
Length
4.9 mm
9.271 mm
Moisture Sensitivity Level
1
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Type
OPEN-DRAIN
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP8,.25
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Packing Method
TUBE
TUBE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Response Time-Nom
3000 ns
3000 ns
Screening Level
TS 16949
TS 16949
Seated Height-Max
1.75 mm
5.334 mm
Supply Current-Max
0.002 mA
0.002 mA
Supply Voltage Limit-Max
7 V
7 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
7.62 mm
Base Number Matches
1
1
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