MCP6541-E/SN
vs
LMC7211BIM
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
No
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
SOIC
SOIC
Package Description
3.90 MM, LEAD FREE, PLASTIC, SOIC-8
SOIC-8
Pin Count
8
8
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Factory Lead Time
9 Weeks
Samacsys Manufacturer
Microchip
Amplifier Type
COMPARATOR
COMPARATOR
Average Bias Current-Max (IIB)
0.005 µA
0.001 µA
Input Offset Voltage-Max
7000 µV
18000 µV
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
JESD-609 Code
e3
e0
Length
4.9 mm
4.9 mm
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Type
PUSH-PULL
PUSH-PULL
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP8,.25
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
235
Qualification Status
Not Qualified
Not Qualified
Response Time-Nom
4000 ns
4000 ns
Seated Height-Max
1.75 mm
1.75 mm
Supply Current-Max
0.001 mA
0.018 mA
Supply Voltage Limit-Max
7 V
16 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3.9 mm
3.9 mm
Base Number Matches
1
2
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Compare MCP6541-E/SN with alternatives
Compare LMC7211BIM with alternatives